Invention Grant
- Patent Title: Printed circuit boards having a dielectric layer which includes a polymer and methods of manufacturing such printed circuit boards
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Application No.: US15476235Application Date: 2017-03-31
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Publication No.: US09986636B2Publication Date: 2018-05-29
- Inventor: Joachim Mahler , Ralf Otremba
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102014107909 20140605
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K1/03 ; H05K1/02 ; H05K3/40 ; H05K3/00 ; H05K1/11
Abstract:
A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer. The polymer includes at least one of a carbon layer structure and a carbon-like layer structure.
Public/Granted literature
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