Invention Grant
- Patent Title: Circuit board
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Application No.: US14817380Application Date: 2015-08-04
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Publication No.: US09986641B2Publication Date: 2018-05-29
- Inventor: Noboru Kato
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-089897 20090402
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01L23/498 ; H05K1/02 ; H05K1/14 ; H05K1/16 ; H05K3/46

Abstract:
A circuit board includes a laminated body including a laminate of a plurality of insulating-material layers made of a flexible material. External electrodes are provided on the top surface of the laminated body. An electronic component is mounted on the external electrodes. A plurality of internal conductors, when viewed in plan in the z-axis direction, are overlaid on the external electrodes and are not connected to one another in regions in which the internal conductors are overlaid on the external electrodes.
Public/Granted literature
- US20150342048A1 CIRCUIT BOARD Public/Granted day:2015-11-26
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