A fluid ejection head having a fluid supply body having a nosepiece with at least one fluid supply port. A pedestal extends outwards from the exterior of the nosepiece near the fluid supply port. A semiconductor chip mounting surface is formed on the pedestal. A flexible circuit bonding surface, formed by a plurality of ribs, also extends outwards from the exterior surface of the nosepiece adjacent the perimeter of the pedestal. A damage reducing structure for reducing damage to a semiconductor chip mounted on the pedestal is located between the pedestal and the flexible circuit bonding surface. Similarly, a damage reducing structure is located between each adjacent pair of the plurality of ribs. In each case, the damage reducing structure may be void space that isolates and reduces damage caused by shock waves traveling through the fluid supply body to the chip mounting surface and the chip mounted thereon.