Invention Grant
- Patent Title: Molding apparatus, molding apparatus unit, and molding method
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Application No.: US15180648Application Date: 2016-06-13
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Publication No.: US09987774B2Publication Date: 2018-06-05
- Inventor: Takahiro Nakahashi , Hiroyuki Hanato
- Applicant: SHARP KABUSHIKI KAISHA
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2012-228161 20121015
- Main IPC: B29C43/58
- IPC: B29C43/58 ; B29C43/54 ; B29C37/00 ; B29C35/02 ; B29C35/08 ; B29C43/02

Abstract:
A molding apparatus (1) includes: a servomotor (11) for pressing a resin component (W) by moving an upper mold (MU) in a direction in which the upper mold (MU) is made close to a lower mold (ML); servomotors (12a and 13a) each of which retains X-coordinate and Y-coordinate positions of the lower mold (ML); and a position detection section (41) which determines whether or not the resin component which is sandwiched between the upper mold and the lower mold has been cured, the servomotors each terminating the retention of the lower mold when the resin component has been cured. This makes it possible to obtain a molded product while preventing positional displacement caused by a decrease in volume of a resin which is being cured.
Public/Granted literature
- US20160297115A1 MOLDING APPARATUS, MOLDING APPARATUS UNIT, AND MOLDING METHOD Public/Granted day:2016-10-13
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