Invention Grant
- Patent Title: Method and device for removing integrated circuits
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Application No.: US14742820Application Date: 2015-06-18
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Publication No.: US09987836B2Publication Date: 2018-06-05
- Inventor: Yong Sun , Xianzhen Tang , Zhiyu Qian , Long Yan , Jun Zhang , Daocheng Zhu , Wei Wang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN CN
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN CN
- Agency: Brooks Kushman P.C.
- Priority: CN201510001238 20150104
- Main IPC: B32B43/00
- IPC: B32B43/00 ; B32B38/10 ; H01L21/77 ; B32B7/00 ; B32B3/10 ; H01L21/302 ; B32B7/12 ; H01L21/44 ; B32B7/06 ; B32B37/12 ; B32B7/04 ; H01L21/70

Abstract:
The present disclosure provides a method and device for removing an integrated circuit. The device is used to remove the integrated circuit from a display panel. The device includes a heating unit configured to contact and heat the display panel, and a retractable clamping-taking component configured to clamp and take the integrated circuit on the display panel which has been heated. According to embodiments of the present disclosure, the method and device may remove the integrated circuit from the display panel without destroying the display panel and increase efficiency of removing the integrated circuit.
Public/Granted literature
- US20160198599A1 METHOD AND DEVICE FOR REMOVING INTEGRATED CIRCUITS Public/Granted day:2016-07-07
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