Invention Grant
- Patent Title: Printhead assembly module
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Application No.: US15311772Application Date: 2014-05-30
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Publication No.: US09987845B2Publication Date: 2018-06-05
- Inventor: Daniel D Dowell
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- International Application: PCT/US2014/040264 WO 20140530
- International Announcement: WO2015/183309 WO 20151203
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
In one example, a printhead assembly module includes an upstream row of printheads and a downstream row of printheads. The upstream and downstream rows of printheads are offset from one another such that a printhead in the upstream row extends past the downstream row at one end of the module and a printhead in the downstream row extends past the upstream row at the other end of the module.
Public/Granted literature
- US20170096004A1 PRINTHEAD ASSEMBLY MODULE Public/Granted day:2017-04-06
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