A package comprises a heat seal between a first film and a second film. The first film comprises at least 70% of one or more polyamides. The first film also comprises at least one modified layer comprising (1) at least 70% of one or more polyamides and (2) one or more modifiers selected from ethylene/alkyl(meth)acrylate copolymers, ethylene/(meth)acrylic acid copolymers, and ionomers. The second film comprises at least 70%) of one or more polyamides. The package is useful under ovenable conditions.