The present invention relates to a hot-melt pressure-sensitive adhesive (HMPSA) composition. The composition includes: a) 25 to 50% of a styrene block copolymer chosen from the group comprising SIS, SIBS, SEBS and SEPS block copolymers; b) 35 to 75% of a compatible tackifying resin having a softening temperature of between 80 and 150° C. and an acid number of less than 20; and c) 0.5 to 20% of one or more carboxylic acids, the hydrocarbon chain of which includes 6 to 22 carbon atoms. The present invention also relates to a multilayer system including an HMPSA layer, a printable support layer, and an adjacent protective layer. Further, the present invention also includes a corresponding self-adhesive label and process for recycling a labeled article which entails debonding of the label by immersing the article in a hot basic aqueous solution.