Invention Grant
- Patent Title: Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
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Application No.: US13582969Application Date: 2011-11-21
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Publication No.: US09988573B2Publication Date: 2018-06-05
- Inventor: Tomohiro Iwano , Takenori Narita , Daisuke Ryuzaki
- Applicant: Tomohiro Iwano , Takenori Narita , Daisuke Ryuzaki
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLC
- Priority: JP2010-260036 20101122
- International Application: PCT/JP2011/076822 WO 20111121
- International Announcement: WO2012/070541 WO 20120531
- Main IPC: C09K13/00
- IPC: C09K13/00 ; C09K13/12 ; C09G1/02 ; C09K3/14 ; H01L21/3105 ; H01L21/306 ; B24B37/04

Abstract:
The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains satisfy either or both of the following conditions (a) and (b). (a) Producing absorbance of at least 1.50 for light with a wavelength of 400 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %, and also producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %. (b) Producing absorbance of at least 1.000 for light with a wavelength of 290 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 0.0065 mass %, and also producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %.
Public/Granted literature
- US20120329370A1 SLURRY, POLISHING LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHING SUBSTRATE, AND SUBSTRATE Public/Granted day:2012-12-27
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