A material deposition system and method for cooling a component after material deposition. The method of deposition and cooling comprising a platform, a deposition head, and a cooling mechanism. The platform adapted to support a component for the addition of material. The deposition head including a material depositor configured to deposit material on a surface of a component supported on the platform an and an energy source configured to energize material deposited onto a surface of a component supported on the platform to bond the material to the component. The cooling system including bristles.