Invention Grant
- Patent Title: Method of machining sealing surface
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Application No.: US13510964Application Date: 2010-11-19
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Publication No.: US09989101B2Publication Date: 2018-06-05
- Inventor: Kentaro Terada
- Applicant: Kentaro Terada
- Applicant Address: JP Osaka
- Assignee: NTN CORPORATION
- Current Assignee: NTN CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2009-275315 20091203
- International Application: PCT/JP2010/070691 WO 20101119
- International Announcement: WO2011/068042 WO 20110609
- Main IPC: B23C3/04
- IPC: B23C3/04 ; F16D3/223 ; F16D3/227 ; F16C33/78 ; F16C33/58

Abstract:
Provided is a method of machining a sealing surface, the method being capable of finishing a sealing surface at low cost and in a short period of time, eliminating lead marks, and forming the sealing surface highly accurately. The method of machining a sealing surface comprises finishing a sealing surface (M), which is to be machined, by cutting the sealing surface (M) using a rotating cutting tool (81) while rotating a workpiece having the sealing surface (M) about an axis thereof. The cutting of the sealing surface (M) using the rotating cutting tool (81) comprises hardened steel cutting which generates no lead marks.
Public/Granted literature
- US20120288341A1 METHOD OF MACHINING SEALING SURFACE Public/Granted day:2012-11-15
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