Invention Grant
- Patent Title: Semiconductor structure and method for manufacturing a semiconductor structure
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Application No.: US15379523Application Date: 2016-12-15
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Publication No.: US09989703B2Publication Date: 2018-06-05
- Inventor: Lukas Czornomaz , Jean Fompeyrine , Jens Hofrichter , Bert Jan Offrein , Mirja Richter
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Bryan D. Wells
- Priority: GB1221581.0 20121130
- Main IPC: G02B6/13
- IPC: G02B6/13 ; H01L23/544 ; G02B6/12

Abstract:
A semiconductor structure and a method for manufacturing the semiconductor structure are provided. The semiconductor structure includes a processed semiconductor substrate. The processed semiconductor substrate includes active electronic components. The semiconductor structure also includes a dielectric layer that covers, at least partially, the processed semiconductor substrate. An interface layer that is suitable for growing optically active material on the interface layer is bonded to the dielectric layer. An optical gain layer and the processed semiconductor substrate are connected through the dielectric layer by electric and/or optical contacts.
Public/Granted literature
- US20170097468A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE Public/Granted day:2017-04-06
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