Invention Grant
- Patent Title: 360 degree hinge assembly for electronic devices
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Application No.: US15163165Application Date: 2016-05-24
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Publication No.: US09990006B2Publication Date: 2018-06-05
- Inventor: Mark E. Sprenger , Kenan Arik , Aleksander Magi , David A. Rittenhouse
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alpine Technology Law Group LLC
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
In one example a hinge assembly for an electronic device comprises a first hinge comprising a first bracket coupled to a first bushing disposed at a first end of the first bracket and rotatable about a first shaft extending through the first bushing. a second hinge comprising, a second bushing, a first linkage arm rotatable about a second shaft extending through the second bushing, and a second linkage arm rotatable about the second shaft extending through the second bushing and a third hinge comprising a second bracket coupled to a second bushing disposed at a first end of the second bracket and rotatable about a third shaft extending though the second bushing, wherein the first linkage arm is rotatably coupled to the first shaft and the second linkage arm is rotatably coupled to the third shaft. Other examples may be described.
Public/Granted literature
- US20170344074A1 360 DEGREE HINGE ASSEMBLY FOR ELECTRONIC DEVICES Public/Granted day:2017-11-30
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