In some embodiments, methods include acquiring a micrograph image of a plated through hole and converting the micrograph image to a binary image. Methods include defining a pixel line at a copper-dielectric material interface of the binary image. In some embodiments, methods include comparing a length of an interface line compared to a length of a portion to determine a roughness of the pixel line. In some embodiments, methods include determining a roughness of the hole wall before copper plating. Methods may include determining a roughness of the interface using the pixel line.