Invention Grant
- Patent Title: Metal gate and manufacturing method thereof
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Application No.: US14671053Application Date: 2015-03-27
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Publication No.: US09991124B2Publication Date: 2018-06-05
- Inventor: Chi-Cheng Hung , Yu-Sheng Wang , Ting-Siang Su , Ching-Hwanq Su
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/78 ; H01L21/285 ; H01L21/28 ; C23C14/02 ; C23C14/18 ; H01L29/49 ; H01L29/51 ; H01L21/768

Abstract:
The present disclosure provides a semiconductor structure, including an active region with a first surface; an isolated region having a second surface, surrounding the active region, the first surface being higher than the second surface; and a metal gate having a plurality of metal layers disposed over the first surface and the second surface. A ratio of a thinnest portion and a thickest portion of at least one of the plurality of metal layers is greater than about 40%.
Public/Granted literature
- US20160211339A1 METAL GATE AND MANUFACUTRING METHOD THEREOF Public/Granted day:2016-07-21
Information query
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