Invention Grant
- Patent Title: Electronic power device with flat electronic interconnection structure
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Application No.: US15585293Application Date: 2017-05-03
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Publication No.: US09991191B2Publication Date: 2018-06-05
- Inventor: Bastien Letowski , Jean-Christophe Crebier , Nicolas Rouger , Julie Widiez
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES , CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
- Applicant Address: FR Paris FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES,CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES,CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
- Current Assignee Address: FR Paris FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1654036 20160504
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/367 ; H01L23/495 ; H02M7/537

Abstract:
Electronic power device comprising: an active layer comprising several lateral and/or semi-lateral components for which the electrodes are located on a front face of the active layer; an interconnection structure comprising several conducting portions to which component electrodes are connected, and located in contact with these electrodes extending parallel to the active layer; a support comprising a front face on which electrically conducting tracks are located, and in which: the interconnection structure is located between the active layer and the support, the conducting portions being placed in contact with the conducting tracks, or the active layer is placed between the interconnection structure and the support, the conducting portions comprising parts extending next to the active layer and connected to the conducting tracks.
Public/Granted literature
- US20170323846A1 ELECTRONIC POWER DEVICE WITH FLAT ELECTRONIC INTERCONNECTION STRUCTURE Public/Granted day:2017-11-09
Information query
IPC分类: