Invention Grant
- Patent Title: Semiconductor package having an EMI shielding layer
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Application No.: US15607270Application Date: 2017-05-26
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Publication No.: US09991211B2Publication Date: 2018-06-05
- Inventor: Anna M. Prakash , Reynaldo Alberto Olmedo , Venmathy McMahan , Rajendra C. Dias , Joshua David Heppner , Ann Jinyan Xu , Sriya Sanyal , Eric Jin Li
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/29
Abstract:
Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.
Public/Granted literature
- US20170287851A1 SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER Public/Granted day:2017-10-05
Information query
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