Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US15361336Application Date: 2016-11-25
-
Publication No.: US09991217B2Publication Date: 2018-06-05
- Inventor: Yasunari Umemoto , Daisuke Tokuda , Tsunekazu Saimei , Hiroaki Tokuya
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2014-003197 20140110
- Main IPC: H01L29/737
- IPC: H01L29/737 ; H01L23/00 ; H01L29/417 ; H01L29/732 ; H01L29/08 ; H01L29/66 ; H01L29/20 ; H01L29/205

Abstract:
A semiconductor device that includes a bipolar transistor, wherein a third opening, through which a pillar bump and a second wiring line, which is electrically connected to an emitter layer, contact each other, is shifted in a longitudinal direction of the emitter layer away from a position at which the third opening would be directly above the emitter layer. The third opening is arranged, with respect to the emitter layer, such that an end portion of the emitter layer in the longitudinal direction of the emitter layer and the edge of the opening of the third opening are substantially aligned with each other.
Public/Granted literature
- US20170077054A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-03-16
Information query
IPC分类: