Invention Grant
- Patent Title: Connector structures of integrated circuits
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Application No.: US15498659Application Date: 2017-04-27
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Publication No.: US09991218B2Publication Date: 2018-06-05
- Inventor: Shang-Yun Tu , Yao-Chun Chuang , Ming Hung Tseng , Chen-Cheng Kuo , Chen-Shien Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/498
Abstract:
A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.
Public/Granted literature
- US20170229413A1 Method of Manufacturing Connector Structures of Integrated Circuits Public/Granted day:2017-08-10
Information query
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