Invention Grant
- Patent Title: Integrated circuit and computer-implemented method of manufacturing the same
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Application No.: US15420514Application Date: 2017-01-31
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Publication No.: US09991249B2Publication Date: 2018-06-05
- Inventor: Seong-Min Ryu , Hyo-Sig Won
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2016-0015820 20160211; KR10-2016-0100122 20160805
- Main IPC: G06F17/00
- IPC: G06F17/00 ; H01L27/02 ; G06F17/50 ; H01L21/768 ; H01L23/522 ; H01L23/528 ; H01L23/532

Abstract:
A computer-implemented method of manufacturing an integrated circuit includes placing a plurality of standard cells that define the integrated circuit, selecting a timing critical path from among a plurality of timing paths included in the placed standard cells, and selecting at least one net from among a plurality of nets included in the timing critical path as at least one timing critical net. The method further includes pre-routing the at least one timing critical net with an air-gap layer, routing unselected nets, generating a layout using the pre-routed at least one timing critical net and the routed unselected nets, and manufacturing the integrated circuit based on the layout.
Public/Granted literature
- US20170236814A1 INTEGRATED CIRCUIT AND COMPUTER-IMPLEMENTED METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-08-17
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