Layers on a resin substrate in a peripheral area include wires extending in a wiring direction, and an inorganic insulating layer. The inorganic insulating layer is formed on first regions under the plurality of respective wires and on second regions each positioned between the adjacent first regions. The inorganic insulating layer includes a first portion on each first region. The inorganic insulating layer includes a second portion on each second region. The first portion is continuous in the wiring direction. The second portion is formed in at least either one of the manners such that the second portion is formed while avoiding a part of the second region on which the second portion is disposed or that the second portion is formed thinner than the first portion, and is continuous to the first portion adjacent to the second portion.