Invention Grant
- Patent Title: Semiconductor device, method for manufacturing the same, and power conversion system
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Application No.: US15695670Application Date: 2017-09-05
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Publication No.: US09991336B2Publication Date: 2018-06-05
- Inventor: Masatoshi Wakagi , Taiga Arai , Mutsuhiro Mori , Tomoyasu Furukawa
- Applicant: HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
- Applicant Address: JP Ibaraki
- Assignee: Hitachi Power Semiconductor Device Ltd.
- Current Assignee: Hitachi Power Semiconductor Device Ltd.
- Current Assignee Address: JP Ibaraki
- Agency: Volpe and Koenig, P.C.
- Priority: JP2016-187705 20160927
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L29/06 ; H01L27/06 ; H01L29/66 ; H01L21/322 ; H02M7/5395 ; H01L29/861 ; H02P27/08

Abstract:
An anode electrode and a cathode electrode formed on a silicon semiconductor substrate, p-type layer formed next to the anode electrode, an n-type layer formed next to the cathode electrode by a V-group element being diffused, an n− layer formed between the p-type layer and the n-type layer, and an n-buffer layer formed between the n− layer and the n-type layer and containing oxygen are provided and an oxygen concentration in an area of a width of at least 30 μm from a surface on a side of the n-type layer of the cathode electrode toward the anode electrode is set to 1×1017 cm−3 or more and also the oxygen concentration of the n− layer in a position in contact with the p-type layer is set to less than 3×1017 cm−3.
Public/Granted literature
- US20180090564A1 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND POWER CONVERSION SYSTEM Public/Granted day:2018-03-29
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