Invention Grant
- Patent Title: Silicon carbide EPI wafer and method for manufacturing same
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Application No.: US15502055Application Date: 2015-07-31
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Publication No.: US09991344B2Publication Date: 2018-06-05
- Inventor: Seok Min Kang
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2014-0100981 20140806
- International Application: PCT/KR2015/008063 WO 20150731
- International Announcement: WO2016/021886 WO 20160211
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/16 ; H01L21/02

Abstract:
An embodiment provides: a method for manufacturing a silicon carbide epi wafer, the method comprising the steps of preparing a wafer, applying a reaction gas to the wafer, heating the reaction gas to generate an intermediate compound, and forming a silicon carbide epi layer on the wafer using the generated intermediate compound, wherein the reaction gas contains a plurality of hydrocarbon compounds; and a silicon carbide epi wafer comprising a silicon carbide epi layer formed by a reaction gas containing a plurality of hydrocarbon compounds, wherein the C/Si value of the silicon carbide epi layer is uniform on the wafer, and thus the uniformity of the silicon carbide epi layer on the wafer can be improved.
Public/Granted literature
- US20170229547A1 Silicon Carbide EPI Wafer and Method for Manufacturing Same Public/Granted day:2017-08-10
Information query
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