Implantation formed metal-insulator-semiconductor (MIS) contacts
Abstract:
A method of forming a metal-insulator-semiconductor (MIS) contact, a transistor including the MIS contact, and the MIS contact are described. The method includes etching an opening for formation of the contact, the opening extending to an upper surface of a semiconductor region. The method also includes implanting metal ions at a selected depth within the upper surface of the semiconductor region and converting the upper surface of the semiconductor region to a metal oxide insulating layer. The method further includes forming a metal layer on the insulating layer.
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