- Patent Title: Implantation formed metal-insulator-semiconductor (MIS) contacts
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Application No.: US15068973Application Date: 2016-03-14
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Publication No.: US09991355B2Publication Date: 2018-06-05
- Inventor: Chia-Yu Chen , Zuoguang Liu , Tenko Yamashita , Chun-Chen Yeh
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Louis Percello
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/45 ; H01L29/417 ; H01L21/285 ; H01L21/311 ; H01L21/265 ; H01L21/02 ; H01L21/321 ; H01L23/532 ; H01L23/535 ; H01L29/51 ; H01L29/78 ; H01L23/485 ; H01L21/768

Abstract:
A method of forming a metal-insulator-semiconductor (MIS) contact, a transistor including the MIS contact, and the MIS contact are described. The method includes etching an opening for formation of the contact, the opening extending to an upper surface of a semiconductor region. The method also includes implanting metal ions at a selected depth within the upper surface of the semiconductor region and converting the upper surface of the semiconductor region to a metal oxide insulating layer. The method further includes forming a metal layer on the insulating layer.
Public/Granted literature
- US20160211343A1 IMPLANTATION FORMED METAL-INSULATOR-SEMICONDUCTOR (MIS) CONTACTS Public/Granted day:2016-07-21
Information query
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