An ESD protection SCR device includes a semiconductor substrate, an epitaxial layer, device isolation layers, an n-type well formed in an anode region, a first high concentration p-type impurity region formed on a surface portion of the n-type well, a first high concentration n-type impurity region formed on the surface portion of the n-type well, a p-type well formed in an cathode region, a second high concentration n-type impurity region formed on a surface portion of the p-type well, a second high concentration p-type impurity region formed on a surface portion of the p-type well so as to be spaced apart from the second high concentration n-type impurity region, and a third high-concentration p-type impurity region formed on the surface portion of the p-type well so as to surround a side portion of the second high-concentration n-type impurity region, adjacent to the anode region.