Invention Grant
- Patent Title: Wiring module
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Application No.: US14405914Application Date: 2013-05-31
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Publication No.: US09991495B2Publication Date: 2018-06-05
- Inventor: Osamu Nakayama , Mitsutoshi Morita
- Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Mie JP Osaka JP Mie
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.,AUTONETWORKS TECHNOLOGIES, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.,AUTONETWORKS TECHNOLOGIES, LTD.
- Current Assignee Address: JP Mie JP Osaka JP Mie
- Agency: Oliff PLC
- Priority: JP2012-129803 20120607
- International Application: PCT/JP2013/065199 WO 20130531
- International Announcement: WO2013/183559 WO 20131212
- Main IPC: H01M2/20
- IPC: H01M2/20

Abstract:
Adjacent coupling units of a plurality of coupling units are slidably coupled via connecting members in a connection direction of the connecting members. Of the plurality of coupling units, one coupling unit of adjacent coupling units that are not coupled to each other via the corresponding connecting member includes an extension portion that is extended toward another connecting member that is different from the connecting member that couples the one coupling unit. The extension portion holds the other connecting member.
Public/Granted literature
- US20150287969A1 WIRING MODULE Public/Granted day:2015-10-08
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