Invention Grant
- Patent Title: Component with at least one opening
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Application No.: US15319921Application Date: 2015-06-15
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Publication No.: US09991691B2Publication Date: 2018-06-05
- Inventor: Joachim Buhl , Jens Menke , Klaus Scharrer , Matthias Wieczorek , Jan Zenichowski , Robert Bradic , Gerhard Rapp
- Applicant: CONTI TEMIC MICROELECTRONIC GMBH , EDEGS FORMENBAU GMBH
- Applicant Address: DE Nuremberg DE Freiberg/Neckar
- Assignee: Conti Temic microelectronic GmbH,EDEGS Formenbau GmbH
- Current Assignee: Conti Temic microelectronic GmbH,EDEGS Formenbau GmbH
- Current Assignee Address: DE Nuremberg DE Freiberg/Neckar
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- Priority: DE102014211593 20140617
- International Application: PCT/EP2015/063346 WO 20150615
- International Announcement: WO2015/193245 WO 20151223
- Main IPC: H02G15/013
- IPC: H02G15/013 ; H02G3/08

Abstract:
A component has at least one opening through which an electric and/or electronic contact element is guided outwards in a sealed manner against the penetration of environmental media. A closed volume is formed at least in a wall of the component in the region of the contact element, and a permanently elastic sealing material which completely surrounds the at least one contact element in at least some sections is filled into said volume.
Public/Granted literature
- US20170133831A1 Component With At Least One Opening Public/Granted day:2017-05-11
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