• Patent Title: MEMS component and method for the production thereof
  • Application No.: US14420871
    Application Date: 2013-08-01
  • Publication No.: US09991822B2
    Publication Date: 2018-06-05
  • Inventor: Pirmin Hermann Otto Rombach
  • Applicant: EPCOS AG
  • Applicant Address: JP Tokyo
  • Assignee: TDK Corporation
  • Current Assignee: TDK Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Nixon Peabody LLP
  • Priority: DE102012107457 20120814
  • International Application: PCT/EP2013/066208 WO 20130801
  • International Announcement: WO2014/026857 WO 20140220
  • Main IPC: H02N1/08
  • IPC: H02N1/08 B81B3/00
MEMS component and method for the production thereof
Abstract:
The invention proposes a MEMS component having a crystalline base body (GK), a recess (AN) and a structured assembly (A) which closes said recess, in which an opening (OG) is structured in a first functional layer (MN), the effective opening cross section thereof varying as a function of the pressure difference on the two sides of the first functional layer (MN).
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