Invention Grant
- Patent Title: Electronic apparatus
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Application No.: US15253698Application Date: 2016-08-31
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Publication No.: US09991925B2Publication Date: 2018-06-05
- Inventor: Katsumi Arao , Akito Iwai
- Applicant: KYOCERA CORPORATION
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Procopio Cory Hargreaves and Savitch LLP
- Priority: JP2014-034940 20140226
- Main IPC: H04B1/3888
- IPC: H04B1/3888 ; G06F1/16 ; H04M1/02 ; H04M1/18
Abstract:
A cover panel is disposed on a surface of an electronic apparatus and is made of sapphire. A flexible printed wiring board extends in a state of being curved in the electronic apparatus. A gap reduction member is in contact with at least a curved portion of the flexible printed wiring board from the cover panel side.
Public/Granted literature
- US20170054468A1 ELECTRONIC APPARATUS Public/Granted day:2017-02-23
Information query
