Invention Grant
- Patent Title: Loudspeaker having passive heat dissipation assembly
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Application No.: US15370173Application Date: 2016-12-06
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Publication No.: US09992562B1Publication Date: 2018-06-05
- Inventor: Hong Gee Keong
- Applicant: Tymphany HK Limited
- Applicant Address: HK Wanchai
- Assignee: TYMPHANY HK LIMITED
- Current Assignee: TYMPHANY HK LIMITED
- Current Assignee Address: HK Wanchai
- Agency: Cantor Colburn LLP
- Main IPC: H04R1/02
- IPC: H04R1/02 ; H04R1/28 ; H05K7/20

Abstract:
A loudspeaker including a first housing which delimits a acoustic chamber, an acoustic driver disposed within the acoustic chamber, a second housing which delimits a second chamber disposed adjacent to the acoustic chamber, a heat source disposed within the second chamber, a passive radiator disposed in communication with the acoustic chamber and the second chamber, a vent disposed in communication with the second chamber and with an exterior of the loudspeaker, wherein the passive radiator is configured to move in response to a movement of the driver, where the passive radiator is further configured to direct an airflow proximate to the heat source during the movement of the passive radiator and to direct the airflow through the vent to the exterior of the loudspeaker.
Public/Granted literature
- US20180160204A1 LOUDSPEAKER HAVING PASSIVE HEAT DISSIPATION ASSEMBLY Public/Granted day:2018-06-07
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