Invention Grant
- Patent Title: Printed circuit board capacitor structures
-
Application No.: US15138870Application Date: 2016-04-26
-
Publication No.: US09992860B2Publication Date: 2018-06-05
- Inventor: Benjamin Toby , Karl J. Bois
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H02M3/06
- IPC: H02M3/06 ; H05K1/02 ; H05K1/18 ; H05K1/11 ; G06F17/50 ; H05K3/00 ; H03H7/00 ; H01P3/08 ; H02M3/22

Abstract:
One example includes a printed circuit board (PCB) structure. The PCB structure includes a first dereferenced microstrip and a first capacitor pad contacting the first dereferenced microstrip. The PCB structure includes a second dereferenced microstrip and a second capacitor pad contacting the second dereferenced microstrip. The PCB structure also includes a capacitor including a first terminal contacting the first capacitor pad and a second terminal contacting the second capacitor pad.
Public/Granted literature
- US20170311434A1 PRINTED CIRCUIT BOARD CAPACITOR STRUCTURES Public/Granted day:2017-10-26
Information query