Invention Grant
- Patent Title: Electronic component and circuit board having the same
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Application No.: US15248512Application Date: 2016-08-26
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Publication No.: US09997294B2Publication Date: 2018-06-12
- Inventor: Hae Suk Chung , Kyung Pyo Hong , Mi Suk Lee , Min Hyang Kim , Kyeong Jun Kim , Tae Ho Song , Seung Hyun Ra
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2016-0013360 20160203
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/005 ; H01G4/232 ; H01G4/12 ; H01G4/248 ; H05K3/32
Abstract:
An electronic component includes a body including a dielectric material and an internal electrode embedded in the dielectric material, an external electrode disposed on the body and connected to the internal electrode, and a conductive adhesive connected to the external electrode. The external electrode and the conductive adhesive include a conductive resin. A circuit board includes the electronic component.
Public/Granted literature
- US20170223832A1 ELECTRONIC COMPONENT AND CIRCUIT BOARD HAVING THE SAME Public/Granted day:2017-08-03
Information query
