Invention Grant
- Patent Title: Method of determining curing conditions, method of producing circuit device, and circuit device
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Application No.: US14406958Application Date: 2014-04-16
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Publication No.: US09997491B2Publication Date: 2018-06-12
- Inventor: Takeshi Ichimura
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2013-142400 20130708
- International Application: PCT/JP2014/002163 WO 20140416
- International Announcement: WO2015/004830 WO 20150115
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H01L23/00 ; H05K3/34 ; H05K3/36 ; H01L21/56 ; H01L23/29 ; H01L23/31 ; H05K1/14
Abstract:
A method of determining curing conditions is for determining the curing conditions of a thermosetting resin to seal a conductive part between a substrate and an electronic component. A curing degree curve is created. The curing degree curve indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin. On the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin, at a first heating temperature, is calculated. The first heating temperature is one of the heating temperatures.
Public/Granted literature
- US20160148899A1 METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUIT DEVICE, AND CIRCUIT DEVICE Public/Granted day:2016-05-26
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