An electroplating method that includes: a) contacting a first substrate (2) with a first electroplating article (4), which includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from an electroplating bath (58) which is a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. The method may be used in the microfabrication of miniaturized devices. Electroplating articles and electroplating apparatus are also disclosed.