Invention Application
WO2005123282A2 METHODS FOR WET CLEANING QUARTZ SURFACES OF COMPONENTS FOR PLASMA PROCESSING CHAMBERS
审中-公开
用于等离子体处理室的组件的清洁清洗表面的方法
- Patent Title: METHODS FOR WET CLEANING QUARTZ SURFACES OF COMPONENTS FOR PLASMA PROCESSING CHAMBERS
- Patent Title (中): 用于等离子体处理室的组件的清洁清洗表面的方法
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Application No.: PCT/US2005019466Application Date: 2005-06-03
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Publication No.: WO2005123282A2Publication Date: 2005-12-29
- Inventor: SHIH HONG , HUANG TUOCHUAN , OUTKA DUANE , KUO JACK , LIU SHENJIAN , MOREL BRUNO , CHEN ANTHONY
- Applicant: LAM RES CORP , SHIH HONG , HUANG TUOCHUAN , OUTKA DUANE , KUO JACK , LIU SHENJIAN , MOREL BRUNO , CHEN ANTHONY
- Assignee: LAM RES CORP,SHIH HONG,HUANG TUOCHUAN,OUTKA DUANE,KUO JACK,LIU SHENJIAN,MOREL BRUNO,CHEN ANTHONY
- Current Assignee: LAM RES CORP,SHIH HONG,HUANG TUOCHUAN,OUTKA DUANE,KUO JACK,LIU SHENJIAN,MOREL BRUNO,CHEN ANTHONY
- Priority: US86336004 2004-06-09
- Main IPC: B08B3/12
- IPC: B08B3/12 ; C23C16/00 ; C23C16/44
Abstract:
Methods for wet cleaning quartz surfaces of components for plasma processing chambers in which semiconductor substrates are processed, such as etch chambers and resist stripping chambers, include contacting the quartz surface with at least one organic solvent, a basic solution and different acid solutions, so as to remove organic and metallic contaminants from the quartz surface. The quartz surface is preferably contacted with one of the acid solutions at least two times.
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