Invention Application
- Patent Title: THREE-DIMENSIONAL (3D) PRINTING BUILD MATERIAL COMPOSITION
- Patent Title (中): 三维(3D)打印材料组成
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Application No.: PCT/US2015/041745Application Date: 2015-07-23
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Publication No.: WO2017014784A1Publication Date: 2017-01-26
- Inventor: NAUKA, Krzysztof , TOM, Howard S. , ERICKSON, Kristopher J. , ZHAO, Lihua , GANAPATHIAPPAN, Sivapackia
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: 11445 Compaq Center Drive W. Houston, Texas 77070 US
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: 11445 Compaq Center Drive W. Houston, Texas 77070 US
- Agency: LEMMON, Marcus B. et al.
- Main IPC: C08K3/00
- IPC: C08K3/00 ; C08K5/00 ; C08L101/00 ; B33Y70/00
Abstract:
A three-dimensional printing build material composition includes a polymer particle, and a radiation absorbing additive mixed with the polymer particle. The radiation absorbing additive has a particle size ranging from about 1 µm to about 100 µm, and the radiation absorbing additive is to absorb incident radiation having wavelengths ranging from 700 nm to 10 µm.
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