Abstract:
A nonvolatile ferroelectric semiconductor memory to which rewrite can be performed stably without losing data of a low logical voltage in memory cells. In the memory, for example, diodes (1 and 2) are connected to cell plate lines (39 and 40) as shown in the figure. When rewrite is performed, therefore, the transient phenomenon that the voltage at the cell plate line (39) temporarily changes to a negative overvoltage (for example, below -1 V), causing the data to be lost, is prevented.
Abstract:
A xylene exchange (P44) is performed on a stock solution of BST of greater than 99.999 % purity dissolved in methoxyethanol, and a carboxylate of a dopant metal, such as magnesium 2-ethylhexanoate is added to form a precursor. The precursor is spun (P45) on a first electrode (14), dried (P46) at 400 DEG C for 2 minutes, then annealed (P47) at 750 DEG C to 800 DEG C for about an hour to form a layer (15) of accurately doped BST. A second electrode (16) is deposited (P48), patterned (P49), and annealed (P50) at between 750 DEG C to 800 DEG C for about 30 minutes. Excellent leakage current results if the dopant is magnesium of about 5 % molarity. For other dopants, such as Mg, Nb, Y, Bi, and Sn the preferred dopant range is 0.2 % to 0.3 % molarity. The magnesium-doped material is used as a buffer layer (25, 27) between the electrodes (24, 28) and BST dielectric (26) of an undoped BST capacitor (20).
Abstract:
A method for fabricating an integrated circuit capacitor (10, 20, 30) having a dielectric layer (15, 26, 37) comprising BST with excess A-site and B-site materials such as barium and titanium added. An organometallic or metallic soap precursor solution is prepared (P42) comprising a stock solution of BST of greater than 99.999 % purity blended with excess A-site and B-site materials such as barium and titanium such that the barium is in the range of 0.01-100 mol %, and such that the titanium is in the range of 0.01-100 mol %. A xylene exchange (P44) is then performed to adjust the viscosity of the solution for spin-on application to a substrate. The precursor solution is spun on a first electrode (P45), dried (P46) at 400 DEG C for 2 to 10 minutes, then annealed (P47) at 650 DEG C to 800 DEG C for about an hour to form a layer of BST with excess titanium. A second electrode is deposited (P48), patterned (P49), and annealed at between 650 DEG C to 800 DEG C for about 30 minutes. The resultant capacitor (10, 20, 30) exhibits an enlarged dielectric constant with little change in leakage current.
Abstract:
A photoelectronic material is composed of a homogeneous medium which can be controlled in electrical property and ultrafine semiconductor particles which have a mean particle diameter of not larger than 100 nm and scattered in the medium and an element to which the material is applied. In a method for manufacturing the photoelectronic material, a layer in which the ultrafine semiconductor particles are scattered in the medium is formed on a substrate by respectively irradiating a first target which is set in a reaction chamber maintained in a low-pressure rare gas atmosphere and composed of a semiconductor material and a second target which is set in the chamber and composed of a medium material which can be controlled in electrical property with laser beams and collecting ultrafine semiconductor particles having a mean particle diameter of not larger than 100 nm on the substrate by condensing and growing the semiconductor material ablated from the first target and, at the same time, collecting the medium material on the substrate by condensing and growing the material ablated from the second target.
Abstract:
A ferroelectric storage device which can further reduce the fluctuation of the reference potential in a reference memory cell system. The storage device is provided with a reference potential generating circuit which generates a reference potential by averaging potentials read out from two ferroelectric capacitors CD00 and CD20 for reference memory cells storing high-level data and two ferroelectric capacitors CD10 and CD30 for reference memory cells storing low-level data.
Abstract:
A method for driving a matrix video display by which a distortion-free picture is displayed according to video signals having an arbitrary aspect ratio. On the screen (7) of a first aspect ratio of the display, a first video display area (8) of a second aspect ratio where a picture is displayed according to video signals having the second aspect ratio and a second video display area (9) which is the other area than the first area (8) of the first aspect ratio are provided. The second area (9) is used for black display. Such timing of the vertical and horizontal clock signals N, Q that the aspect ratio of the first area (8) is equal to that of video signals H is adopted. The vertical scanning of the display (4) is such that the vertical scanning frequency of the second area (9) is higher than that of the first area (8). The horizontal scanning of the device (4) is such that the horizontal scanning frequency of the second area (9) is higher than that of the first area (8).
Abstract:
An MIS device (20) includes a semiconducting substrate (22), a silicon nitride buffer layer (24), a ferroelectric metal oxyde superlattice material (26), and a noble metal top electrode (28). The layered superlattice material (26) is preferably a strontium bismuth tantalate, strontium bismuth niobate, or strontium bismuth niobium tantalate. The device is constructed according to a preferred method that includes forming the silicon nitride on the semiconducting substrate prior to deposition of the layered superlattice material. The layered superlattice material is preferably deposited using liquid polyoxyalkylated metal organic precursors that spontaneously generate a layered superlattice upon heating of the precursor solution. UV exposure during drying of the precursor liquid imparts a C-axis orientation to the final crystal, and results in improved thin-film electrical properties.
Abstract:
A voltage detecting circuit is provided with a first MOS transistor the gate and drain of which are connected to a first node, a second MOS transistor the gate and drain of which are respectively connected to the first node and a third node, a first resistor connected between the first node and a second node, a second resistor connected between the second node and a ground voltage terminal, a first NOT circuit the input terminal of which is connected to the second node, the output terminal of which is a fourth node and which is connected between the third node and the ground voltage terminal, and a second NOT circuit the input terminal of which is connected to the fourth node, and the output terminal of which is a fifth node. The circuit stably detects a voltage without consuming much electric power.
Abstract:
A silicone nitride barrier layer (12) is deposited on a gallium arsenide substrate (11) to prevent evaporation of the substrate in subsequent heating steps. A silicon dioxide stress reduction layer (14) is deposited on the barrier layer. A first electrode (16) comprising an adhesion layer (18) and a second layer (20) is formed on the stress reduction layer. An essentially anhydrous alkoxycarboxylate liquid precursor is prepared, just before use a solvent exchange step is performed, then the precursor is spun on the first electrode, dried at 400 DEG C, and annealed at between 600 DEG C and 850 DEG C to form a BST capacitor dielectric (22). A second electrode (24) is deposited on the dielectric and annealed.
Abstract:
In a ferroelectric storage device, the influences of lower electrodes (111a and 111b) constituting ferroelectric capacitors (110a1-110a3 and 110b1-110b3) and the thermal stresses of the electrodes (111a and 111b) on a ferroelectric layer (113) formed on the electrodes (111a and 111b) can be relieved and, as a result, the disconnection of wires (106a1, 106a2, etc.) connected to the elect rodes (111a and 111b) due to the thermal stresses of the electrodes (111a and 111b) or the characteristic fluctuation or variation of the ferroelectric capacitors (110a1-110a3 and 110b1-110b3) due to the thermal stresses of the electrodes (111a and 111b) applied to the ferroelectric layer (113) are suppressed. The electrodes (111a and 111b) are bent at a plurality of points so that the electrodes can have zigzag planar shapes and divided into pluralities of wiring sections (111a1 and 111a2 and 111b1 and 111b2).