Abstract:
Waveguide-to-transmission line transitions are provided for broadband, high performance coupling of power at microwave and millimeter wave frequencies. In one aspect, a transition apparatus (10) includes a transition housing (11) comprising a rectangular waveguide channel (C) and an aperture (13) formed through a broad wall (11a) of the rectangular waveguide channel (C), a substrate ( 12) having a first surface and a second surface opposite the first surface, mid a planar transmission line (12a) and a planar probe (12b) formed on the first surface, wherein the planar transmission line (12a) comprises a first conductive strip and a second conductive strip, wherein the planar probe (12b) is connected to, and extends from, an end of the first conductive strip, and wherein an end of the second conductive strip is terminated by a stub and wherein the substrate (22) is positioned in the aperture (13) such that the printed probe (12b) protrudes into the rectangular waveguide channel (C) at an offset from a center of the broad wall (11a) and wherein the ends of the first and second conductive strip are aligned to an inner surface of the broad wail (11a) of the rectangular waveguide channel (C).
Abstract:
Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips and antenna devices which are integrally constructed from package frame structures (e.g., lead frame, package carrier, package core, etc.), to thereby form compact integrated radio/wireless communications systems for millimeter wave applications. For example, an electronic apparatus (30) includes a package frame (11) having an antenna (12) that is integrally formed as part of the package frame (11), an IC (integrated circuit) chip (13) mounted to the package frame (11), interconnects (19) that provide electrical connections to the IC chip (13) and the antenna (12), and a package cover (15).
Abstract:
Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications. In one aspect, an electronic apparatus (20) includes an IC chip (22) and an antenna system (23), wherein the IC chip (22) and antenna system (23) are integrally packaged together in a leaded chip-scale package (21) and wherein the antenna system (23) includes an antenna having a radiating element that is formed from a package lead wire.
Abstract:
Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips and antenna devices which are integrally constructed from package frame structures (e.g., lead frame, package carrier, package core, etc.), to thereby form compact integrated radio/wireless communications systems for millimeter wave applications. For example, an electronic apparatus (30) includes a package frame (11) having an antenna (12) that is integrally formed as part of the package frame (11), an IC (integrated circuit) chip (13) mounted to the package frame (11), interconnects (19) that provide electrical connections to the IC chip (13) and the antenna (12), and a package cover (15).
Abstract:
Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications. In one aspect, an electronic apparatus (20) includes an IC chip (22) and an antenna system (23), wherein the IC chip (22) and antenna system (23) are integrally packaged together in a leaded chip-scale package (21) and wherein the antenna system (23) includes an antenna having a radiating element that is formed from a package lead wire.
Abstract:
Waveguide-to-transmission line transitions are provided for broadband, high performance coupling of power at microwave and millimeter wave frequencies. In one aspect, a transition apparatus (10) includes a transition housing (11) comprising a rectangular waveguide channel (C) and an aperture (13) formed through a broad wall (11a) of the rectangular waveguide channel (C), a substrate ( 12) having a first surface and a second surface opposite the first surface, mid a planar transmission line (12a) and a planar probe (12b) formed on the first surface, wherein the planar transmission line (12a) comprises a first conductive strip and a second conductive strip, wherein the planar probe (12b) is connected to, and extends from, an end of the first conductive strip, and wherein an end of the second conductive strip is terminated by a stub and wherein the substrate (22) is positioned in the aperture (13) such that the printed probe (12b) protrudes into the rectangular waveguide channel (C) at an offset from a center of the broad wall (11a) and wherein the ends of the first and second conductive strip are aligned to an inner surface of the broad wail (11a) of the rectangular waveguide channel (C).