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公开(公告)号：CN1185702C
公开(公告)日：2005-01-19
申请号：CN98800579.4
申请日：1998-04-24
Applicant: 时至准钟表股份有限公司
IPC: H01L23/12
CPC classification number: H01L24/81 , H01L21/561 , H01L21/563 , H01L23/3121 , H01L23/3128 , H01L24/48 , H01L24/97 , H01L2224/13111 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/81801 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
Abstract: 经过下述工序形成半导体封装：粘贴工序，用于把经过基板电路形成工序、IC芯片装配工序、树脂密封工序和电极形成工序形成的封装集合体100a粘贴到基准构件8上；切断工序，用于在粘贴工序之后，对封装集合体进行切片，切分成一个一个的电路基板1。
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公开(公告)号：CN1225750A
公开(公告)日：1999-08-11
申请号：CN98800579.4
申请日：1998-04-24
Applicant: 时至准钟表股份有限公司
IPC: H01L23/12
CPC classification number: H01L24/81 , H01L21/561 , H01L21/563 , H01L23/3121 , H01L23/3128 , H01L24/48 , H01L24/97 , H01L2224/13111 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/81801 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
Abstract: 经过下述工序形成半导体封装:粘贴工序,用于把经过基板电路形成工序、IC芯片装配工序、树脂密封工序和电极形成工序形成的封装集合体100a粘贴到基准构件8上;切断工序,用于在粘贴工序之后,对封装集合体进行切片,切分成一个一个的电路基板1。
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