화학적 기계적 연마용 슬러리 조성물
    2.
    发明公开
    화학적 기계적 연마용 슬러리 조성물 有权
    化学机械抛光用浆料组合物

    公开(公告)号:KR1020110043244A

    公开(公告)日:2011-04-27

    申请号:KR1020090100277

    申请日:2009-10-21

    Abstract: PURPOSE: A slurry composition for chemical mechanical polishing is provided to enable the application to various patterns required for an ultra-integrated semiconductor process and to improve a polishing rate and polishing selectivity. CONSTITUTION: A slurry composition for chemical mechanical polishing includes: at least one abrasive with a solid content of 0.5-10 weight%, selected from the group consisting of ceria, alumina, silica, titania and zirconia; and a complexing agent having a carboxy group or amino group. The slurry composition further includes oxidants or anticorrosive agents.

    Abstract translation: 目的:提供用于化学机械抛光的浆料组合物,使得能够应用于超集成半导体工艺所需的各种图案并提高抛光速率和抛光选择性。 构成:用于化学机械抛光的浆料组合物包括:至少一种固体含量为0.5-10重量%的研磨剂,选自二氧化铈,氧化铝,二氧化硅,二氧化钛和氧化锆; 和具有羧基或氨基的络合剂。 浆料组合物还包括氧化剂或防腐剂。

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