公开(公告)号：KR1020100110937A

公开(公告)日：2010-10-14

申请号：KR1020090029220

申请日：2009-04-06

Applicant: 아주대학교산학협력단

Inventor： 이석현 ,  권오필 ,  정명조 ,  윤종진

IPC: C25D7/06 ,  H01B7/08 ,  C25D5/00

CPC classification number: C25D7/0607 ,  C25D5/34

Abstract: PURPOSE: A method for plating flat cables by using a conductive paste is provided to minimize the error rate of a flat cable by performing plating by supplying power with being coated with conductive paste. CONSTITUTION: A method for plating flat cables by using a conductive paste is as follows. First exposing units(110A,110B) formed in both ends of flat cable is coated to the conductive paste. A second exposing unit(120) is plated by supplying power to the first exposing unit which is coated with conductive paste when the second exposing unit is dipped in plating bath(300) filled with plating solution.

Abstract translation: 目的：提供一种通过使用导电膏对扁平电缆进行电镀的方法，以通过在涂覆导电浆料的同时进行电镀来最小化扁平电缆的误差率。 构成：通过使用导电膏对扁平电缆进行电镀的方法如下。 形成在扁平电缆的两端的第一曝光单元（110A，110B）被涂覆到导电浆料上。 当将第二曝光单元浸入填充有电镀液的电镀槽（300）中时，通过向涂覆有导电浆料的第一曝光单元供电来对第二曝光单元（120）进行镀覆。