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公开(公告)号：WO2014182120A1
公开(公告)日：2014-11-13
申请号：PCT/KR2014/004151
申请日：2014-05-09
IPC: H01L23/48
CPC classification number: H01L23/49827 , H01L21/486 , H01L23/15 , H01L23/5384 , H01L2924/0002 , H01L2924/00
Abstract: 인터포저 기판의 관통전극 형성 방법 및 인터포저 기판을 포함하는 반도체 패키지가 개시된다. 본 발명의 인터포저 기판의 관통전극 형성 방법은 홀이 형성된 감광성 유리 기판을 마련하는 단계, 및 상기 홀에 용융금속을 충진하여 관통전극을 형성하는 단계를 포함한다.
Abstract translation: 公开了一种用于形成中介基板的贯通电极的方法，以及包括该中介基板的半导体封装。 根据本发明的用于形成中介层基板的贯通电极的方法包括以下步骤：制备具有孔的感光性玻璃基板; 以及通过用熔融金属填充孔而形成通孔。
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公开(公告)号：KR101918485B1
公开(公告)日：2018-11-14
申请号：KR1020160057941
申请日：2016-05-12
Applicant: 조수제
Inventor： 조수제
IPC: B01L3/00
Abstract: 순환종양세포클러스터검출장치및 그방법이개시된다. 본발명의순환종양세포클러스터검출장치는혈액이유입되는유입구와상기유입구를통해유입된혈액이흐르는혈액경로가형성된몸체, 및상기몸체의혈액경로와연결된 CTC 클러스터필터를포함하며, 상기 CTC 클러스터필터는, 필터기판, 및상기필터기판에수직또는사선으로형성되어, 상기혈액을구성하는복수의성분들중 일정크기이상의제1 성분은통과시키지않고, 나머지는통과시키는복수의마이크로채널들을포함한다.
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公开(公告)号：KR1020140100178A
公开(公告)日：2014-08-14
申请号：KR1020130013153
申请日：2013-02-06
IPC: H01L23/48 , H01L27/146
CPC classification number: H01L27/14687 , H01L23/544 , H01L27/14636 , H01L27/1469
Abstract: A wafer level packaging method of an electronic device according to an embodiment of the present invention, comprising the step of forming an electronic device layer in which an electronic device is formed and an adhesive layer on the front surface of a wafer including a pad for connecting the electronic device to the outside; forming a through-hole in a position corresponding to the pad of a photosensitive glass substrate; arraying the wafer and the photosensitive glass substrate to make the through-hole to be arranged on the pad, and bonding the adhesive layer and the photosensitive glass substrate; and forming a through-electrode by removing the adhesive layer corresponding to lower portion of the through-hole and filling the through-hole with a metal material.
Abstract translation: 根据本发明实施例的电子器件的晶片级封装方法，包括形成其中形成电子器件的电子器件层的步骤和在包括用于连接的焊盘的晶片的前表面上的粘合剂层 电子设备到外面; 在与感光性玻璃基板的焊盘对应的位置形成贯通孔; 排列晶片和感光性玻璃基板以使通孔布置在焊盘上，并粘合粘合剂层和感光性玻璃基板; 并且通过除去与通孔的下部相对应的粘合剂层并用金属材料填充通孔来形成通孔。
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公开(公告)号：KR1020040042070A
公开(公告)日：2004-05-20
申请号：KR1020020070203
申请日：2002-11-12
Applicant: 조수제
Inventor： 조수제
IPC: B81C1/00
CPC classification number: B81C1/00015 , C03B29/00
Abstract: PURPOSE: A method for micromachining photosensitive glass is provided to fabricate various high functional devices by micromachining a photosensitive glass substrate having a predetermined shape. CONSTITUTION: A method for micromachining photosensitive glass comprises the steps of crystallizing a photosensitive glass substrate, which is exposed to ultraviolet ray through a photo mask, converting a shape of the photosensitive glass substrate into a predetermined shape, such as a curved shape, by applying external physical force to the photosensitive glass substrate, and cooling the photosensitive glass substrate. After cooling the photosensitive glass substrate, crystallized portions of the photosensitive glass substrate is selectively etched, thereby forming a micro structure.
Abstract translation: 目的：提供一种微加工光敏玻璃的方法，通过微加工具有预定形状的感光玻璃基板来制造各种高功能器件。 构成：用于微加工感光玻璃的方法包括以下步骤：将通过光掩模曝光于紫外线的感光性玻璃基板结晶，将感光性玻璃基板的形状转换为规定形状，例如弯曲形状， 对感光性玻璃基板的外部物理力，并且对感光性玻璃基板进行冷却。 在感光玻璃基板冷却之后，选择性地蚀刻感光玻璃基板的结晶部分，从而形成微结构。
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Patent Agency Ranking
公开(公告)号：KR101468680B1
公开(公告)日：2014-12-04
申请号：KR1020130052517
申请日：2013-05-09
IPC: H01L23/48
CPC classification number: H01L23/49827 , H01L21/486 , H01L23/15 , H01L23/5384 , H01L2924/0002 , H01L2924/00
Abstract: 본발명의실시예에따른인터포저기판의관통전극형성방법은홀이형성된감광성유리기판을마련하는단계, 및상기홀에용융금속을충진하여관통전극을형성하는단계를포함한다.
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公开(公告)号：KR1020140100179A
公开(公告)日：2014-08-14
申请号：KR1020130013154
申请日：2013-02-06
IPC: H01L23/48 , H01L27/146
CPC classification number: H01L27/14687 , H01L23/544 , H01L27/14636 , H01L27/1469
Abstract: A wafer level packaging method of an electronic device according to an embodiment of the present invention includes a step of forming a bonding layer on the front surface of a wafer, which includes an electrode device layer having an electrode device inside and a pad for connecting the electrode device to the outside; a step of crystallizing a region corresponding to the pad of a photosensitive glass substrate; a step of arranging the photosensitive glass substrate and the wafer to locate the crystallized region in the upper part of the wafer and combining the bonding layer with the photosensitive glass substrate; a step of forming a through hole by removing the crystallized region and removing the bonding layer corresponding to the lower part of the through hole; and a step of forming the through hole by filling the through hole with a metallic material.
Abstract translation: 根据本发明的实施例的电子器件的晶片级封装方法包括在晶片的前表面上形成接合层的步骤，该步骤包括具有内部具有电极器件的电极器件层和用于连接 电极装置到外面; 使与感光性玻璃基板的焊盘对应的区域结晶的工序; 将所述感光性玻璃基板和所述晶片配置在所述晶片的上部的结晶化区域并将所述接合层与感光性玻璃基板结合的工序; 通过除去结晶区域并除去与通孔的下部相对应的接合层来形成通孔的步骤; 以及通过用金属材料填充通孔来形成通孔的步骤。
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公开(公告)号：KR2020100011875U
公开(公告)日：2010-12-08
申请号：KR2020090006491
申请日：2009-05-28
Applicant: 조수제
Inventor： 조수제
IPC: H04N5/225
CPC classification number: H04N5/2254 , G02B7/004 , G02B7/021 , H04N1/00307 , H04N5/2257
Abstract: 본 고안은 적어도 1개이상의 렌즈를 포함하는 렌즈 경통, 렌즈경통과 디지탈카메라를 부착하기 위한 부착수단, 피사체와 디지탈카메라의 촛점을 조절하기 위한 촛점조절기구를 갖춘 디지탈카메라 탈 부착형 확대형 렌즈모듈과 디지탈카메라로 구성된 휴대형 현미경 겸용 디지탈카메라에 관한 것이다.
디지탈카메라, 현미경, 렌즈, 촛점, 부착수단-
公开(公告)号：KR100472012B1
公开(公告)日：2005-03-08
申请号：KR1020010080317
申请日：2001-12-17
Applicant: 조수제
Inventor： 조수제
IPC: H05B33/10
Abstract: 본 발명은 진공증착에 의해 박막패턴을 형성하기 위해 사용되는 증착마스크 및 그 제조 방법에 관한 것으로, 대면적의 기판상에 복 수개의 소자를 형성할 때, 각 소자에 해당되는 마스크 부를 소자별로 분리시키고 마스크패턴 부의 외곽에 그 보다 두꺼운 유리판으로 연결 및 보강되게 한 구조를 이루어, 증착 시 마스크의 열변형을 줄이고 정밀한 패턴형성을 가능하게 한 것이다 .
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公开(公告)号：KR1020030035647A
公开(公告)日：2003-05-09
申请号：KR1020010068045
申请日：2001-11-01
Applicant: 조수제
Inventor： 조수제
IPC: H05B33/04
CPC classification number: H01L51/524 , H01L51/5259 , H01L51/56
Abstract: PURPOSE: A cover plate for protecting an organic electro-luminescence device and a fabricating method thereof are provided to enhance the productivity and the reliability by using a glass cover plate instead of a stainless cover plate. CONSTITUTION: A resin pattern portion(3-2) is formed on an upper surface of a glass plate(3-1) in order to endure the impact of ceramic particles. A surface of the glass plate(3-1) is dug as much as the predetermined depth by injecting the ceramic particles on the surface of the glass plate(3-1). A cover plate is formed by removing the resin pattern portion(3-2). A damaged layer(3-4) of an unstable structure is removed from the cover plate by performing an etch process. The cover plate having a clean processed portion(3-5) is formed by removing the damaged layer(3-4) of the unstable structure from the cover plate.
Abstract translation: 目的：提供用于保护有机电致发光器件的盖板及其制造方法，以通过使用玻璃盖板代替不锈钢盖板来提高生产率和可靠性。 构成：为了耐受陶瓷颗粒的冲击，在玻璃板（3-1）的上表面上形成树脂图形部分（3-2）。 通过将陶瓷颗粒注入玻璃板（3-1）的表面，玻璃板（3-1）的表面被挖出多达预定深度。 通过去除树脂图案部分（3-2）形成盖板。 通过进行蚀刻处理，从盖板去除不稳定结构的损伤层（3-4）。 具有清洁处理部分（3-5）的盖板通过从盖板上去除不稳定结构的损坏层（3-4）而形成。
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