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公开(公告)号：KR1020060115545A
公开(公告)日：2006-11-09
申请号：KR1020050038168
申请日：2005-05-06
Applicant: 한국교통대학교산학협력단
Abstract: Provided is a bulk mold compound composition, which has excellent dispersibility, surface roughness, dimensional stability, thermal stability and flame resistance, and is useful for producing electric materials and building materials. The bulk mold compound composition comprises: 100 parts by weight of a mixed polymer resin containing an unsaturated polyester resin and polystyrene resin; 170-400 parts by weight of aluminum hydroxide having a particle diameter of 1-15.0 micrometers; 20-200 parts by weight of hard calcium carbonate having a particle diameter of 0.1-8.0 micrometers; 5.0-30 parts by weight of glass fiber having a length of 3-12 mm; 10-30 parts by weight of chlorinated paraffin; 10-30 parts by weight of antimony trioxide; and 0.5-5 parts by weight of a surfactant.
Abstract translation: 提供具有优异的分散性，表面粗糙度，尺寸稳定性，热稳定性和阻燃性的本体模具化合物组合物，并且可用于生产电气材料和建筑材料。 本发明的模具化合物组合物包含：100重量份含有不饱和聚酯树脂和聚苯乙烯树脂的混合聚合物树脂; 170-400重量份的粒径为1-15.0微米的氢氧化铝; 20-200重量份的粒径为0.1-8.0微米的硬质碳酸钙; 5.0-30重量份长度为3-12毫米的玻璃纤维; 10-30重量份氯化石蜡; 10-30重量份三氧化锑; 和0.5-5重量份的表面活性剂。
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公开(公告)号：KR100885653B1
公开(公告)日：2009-02-25
申请号：KR1020070088608
申请日：2007-08-31
Applicant: 한국교통대학교산학협력단
CPC classification number: C08K7/04 , B29C47/40 , C08K3/04 , C08K3/22 , C08K3/28 , C08K3/34 , C08K3/38 , C08K2003/2227 , C09K5/14 , H05K7/20
Abstract: A composite resin composition is provided to improve thermal conductivity, tensile strength, impact resistance and flextural modulus by using a hybrid filler of fiber filler having the thermal conductivity of 200 W / mK or greater and a particle type filler. A composite resin composition(10) comprises a hybrid filler(150) of a fiber type filler and a particle type filler, dispersed through the whole volume of a polymer matrix containing polyether etherketone. The polymer matrix further includes one selected from polyethylene, polypropylene, polystyrene, polycarbonate, polyamide, polyethersulfide, polyphenylenesulfide, liquid-crystal polymer and polyetheramide.
Abstract translation: 提供一种复合树脂组合物，通过使用导热率为200W / mK以上的纤维填料的混合填料和粒状填料，提高导热性，拉伸强度，耐冲击性和挠曲模量。 复合树脂组合物（10）包括通过整个体积的包含聚醚醚酮的聚合物基质分散的纤维型填料和颗粒型填料的混合填料（150）。 聚合物基体还包括选自聚乙烯，聚丙烯，聚苯乙烯，聚碳酸酯，聚酰胺，聚醚硫醚，聚苯硫醚，液晶聚合物和聚醚酰胺中的一种。
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公开(公告)号：KR100697868B1
公开(公告)日：2007-03-22
申请号：KR1020050038168
申请日：2005-05-06
Applicant: 한국교통대학교산학협력단
Abstract: 벌크 몰드 컴파운드 조성물이 제공된다. 벌크 몰드 컴파운드 조성물은 불포화 폴리에스테르 수지와 폴리스티렌계 수지가 100 중량부가 되도록 혼합된 고분자 수지에 대하여, 1.0~15.0㎛의 입경을 가지는 수산화알미늄 170~400 중량부, 0.1~8.0㎛의 입경을 가지는 중질탄산칼슘 20~200 중량부, 염소화 파라핀 10~30 중량부, 삼산화안티몬 10~30 중량부, 계면활성제를 0.5~5중량부를 포함한다.
벌크 몰드 컴파운드, 불포화 폴리에스테르, 유리섬유, 계면 활성제, 난연성
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