公开(公告)号：KR100450403B1

公开(公告)日：2004-09-30

申请号：KR1020020025483

申请日：2002-05-09

Applicant: 한국전자통신연구원

Inventor： 한경수 ,  노지명 ,  유태환 ,  이종현

IPC: G06F13/40

Abstract: PURPOSE: A fast back-plane of a system using a switch is provided to minimize the crosstalk while increasing a pin use efficiency, and to accept many ports while sufficiently keeping an interval between signal lines on the back-plane. CONSTITUTION: Two switchboards(100,101) embedded with the switch respectively have 32 ports. Eight line cards(102-109) are arranged to a left and a right side symmetrically by four line cards. The port number of respective line cards is 4. For the pattern connection, the switchboards and the ports of the line cards are prevented from entangling with each other by placing the transmitting parts(110,111) and the receiving parts(112,113) to the left and the right side oppositely.

Abstract translation: 目的：提供使用开关的系统的快速背板，以在增加引脚使用效率的同时使串扰最小化，并且在足够保持背板上的信号线之间的间隔的同时接受许多端口。 构成：嵌入交换机的两个交换机（100,101）分别具有32个端口。 八个线路卡（102-109）通过四个线路卡对称地布置在左侧和右侧。 各个线卡的端口号为4.对于图形连接，通过将发送部分（110,111）和接收部分（112,113）放置在左边并防止线卡的交换机和端口彼此缠结， 右侧相反。

公开(公告)号：KR1020030093744A

公开(公告)日：2003-12-11

申请号：KR1020020031587

申请日：2002-06-05

Applicant: 한국전자통신연구원

Inventor： 노지명 ,  유태환

IPC: G01R31/00

Abstract: PURPOSE: An apparatus and a method for inspecting an adhering state of a PCB(Printed Circuit Board) for BGA(Ball Grid Array) type chip are provided to decide the adhering state of balls on the PCB by utilizing an electrostatic discharge protection circuit. CONSTITUTION: An apparatus and a method for inspecting an adhering state of a PCB for BGA type chip includes a contact module(60), a measurement unit(64), and a decision unit(65). The contact module(60) includes a plurality of lead pins(69) which are inserted into a plurality of connection holes(61) of a PCB in order to be electrically connected to balls. The measurement unit(64) measures the electrical potential between the lead pins(69) and the ground. The decision unit(65) decides an adhering state of the balls on the PCB by using the measured electrical potential.

Abstract translation: 目的：提供一种用于检查用于BGA（球栅阵列）型芯片的PCB（印刷电路板）的粘附状态的装置和方法，以通过利用静电放电保护电路来确定PCB上PCB的粘附状态。 构成：用于检查用于BGA型芯片的PCB的粘附状态的装置和方法包括接触模块（60），测量单元（64）和判定单元（65）。 接触模块（60）包括插入PCB的多个连接孔（61）中以便与电球电连接的多个引脚（69）。 测量单元（64）测量引脚（69）和地之间的电位。 决定单元（65）通过使用测量的电位来确定球在PCB上的粘附状态。

公开(公告)号：KR1020030087414A

公开(公告)日：2003-11-14

申请号：KR1020020025483

申请日：2002-05-09

Applicant: 한국전자통신연구원

Inventor： 한경수 ,  노지명 ,  유태환 ,  이종현

IPC: G06F13/40

Abstract: PURPOSE: A fast back-plane of a system using a switch is provided to minimize the crosstalk while increasing a pin use efficiency, and to accept many ports while sufficiently keeping an interval between signal lines on the back-plane. CONSTITUTION: Two switchboards(100,101) embedded with the switch respectively have 32 ports. Eight line cards(102-109) are arranged to a left and a right side symmetrically by four line cards. The port number of respective line cards is 4. For the pattern connection, the switchboards and the ports of the line cards are prevented from entangling with each other by placing the transmitting parts(110,111) and the receiving parts(112,113) to the left and the right side oppositely.

Abstract translation: 目的：提供使用开关的系统的快速背板，以在增加引脚使用效率的同时最小化串扰，并且在充分保持背板上的信号线之间的间隔的同时接受许多端口。 构成：嵌入式交换机的两个交换机（100,101）分别具有32个端口。 八个线卡（102-109）通过四个线卡对称地布置在左侧和右侧。 各线路卡的端口号为4.对于图形连接，通过将发送部件（110,111）和接收部件（112,113）放置在左侧，防止配线架和线卡的端口相互缠结，并且 右侧相反。