Sensor assemblies for electronic devices

    公开(公告)号:AU2019268124B2

    公开(公告)日:2020-04-23

    申请号:AU2019268124

    申请日:2019-11-20

    Applicant: APPLE INC

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can 5 include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or 10 both, which mimic the feel of a mechanical button and enhance a user's experience.

    Sensor assemblies for electronic devices

    公开(公告)号:AU2017321121B2

    公开(公告)日:2019-09-12

    申请号:AU2017321121

    申请日:2017-07-24

    Applicant: APPLE INC

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

    Sensor assemblies for electronic devices

    公开(公告)号:AU2019268124A1

    公开(公告)日:2019-12-12

    申请号:AU2019268124

    申请日:2019-11-20

    Applicant: APPLE INC

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can 5 include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or 10 both, which mimic the feel of a mechanical button and enhance a user's experience.

    Sensor assemblies for electronic devices

    公开(公告)号:AU2017321121A1

    公开(公告)日:2018-10-25

    申请号:AU2017321121

    申请日:2017-07-24

    Applicant: APPLE INC

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

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