公开(公告)号：AU2015268683B2

公开(公告)日：2017-07-13

申请号：AU2015268683

申请日：2015-12-11

Applicant: APPLE INC

Inventor： PAKULA DAVID ,  DINH RICHARD HUNG MINH ,  MYERS SCOTT ,  TAN TANG YEW

IPC: G06F1/16

Abstract: Improved housings for electronic devices are disclosed. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. In other embodiments, apparatus, systems and methods for robustly attaching a cover portion of an electronic device to a bottom portion, e.g., a housing portion, of the electronic device are described. The electronic device can be portable and in some cases handheld.

公开(公告)号：AU2010345078B2

公开(公告)日：2015-04-09

申请号：AU2010345078

申请日：2010-09-24

Applicant: APPLE INC

Inventor： MYERS SCOTT ,  HELEY RICHARD ,  THEOBALD MATTHEW ,  STAGNARO ADAM ,  TAN TANG ,  DINH RICHARD ,  PAKULA DAVID

IPC: G06F1/16

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

公开(公告)号：AU2010345079A1

公开(公告)日：2012-08-30

申请号：AU2010345079

申请日：2010-09-24

Applicant: APPLE INC

Inventor： MYERS SCOTT ,  THEOBALD MATTHEW ,  HELEY RICHARD ,  STAGNARO ADAM ,  DINH RICHARD ,  PAKULA DAVID ,  TAN TANG

IPC: G06F1/16 ,  H04M1/02

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

公开(公告)号：AU2011312129B2

公开(公告)日：2014-06-19

申请号：AU2011312129

申请日：2011-10-07

Applicant: APPLE INC

Inventor： HILL MATTHEW D ,  PILLIOD MICHAEL KANE ,  PREST CHRISTOPHER ,  WEBER DOUGLAS ,  MICHAIL SPYROS ,  PAKULA DAVID

IPC: C03B25/08

Abstract: Apparatus, systems and methods for improving chemical strengthening behavior in glass members are disclosed. According to one aspect, a method for processing a glass part formed using a fusion process or a float process includes annealing the glass part and then chemically strengthening the glass part. Annealing the glass part includes at least heating the glass part at a first temperature, maintaining the first temperature, and cooling the glass part to a second temperature using a controlled cooling process. Chemically strengthening the glass part includes facilitating an ion exchange between ions included in the glass part and ions included in a chemical strengthening bath.

公开(公告)号：AU2011312129A1

公开(公告)日：2013-05-02

申请号：AU2011312129

申请日：2011-10-07

Applicant: APPLE INC

Inventor： HILL MATTHEW D ,  PILLIOD MICHAEL KANE ,  PREST CHRISTOPHER ,  WEBER DOUGLAS ,  MICHAIL SPYROS ,  PAKULA DAVID

IPC: C03B25/08

Abstract: Apparatus, systems and methods for improving chemical strengthening behavior in glass members are disclosed. According to one aspect, a method for processing a glass part formed using a fusion process or a float process includes annealing the glass part and then chemically strengthening the glass part. Annealing the glass part includes at least heating the glass part at a first temperature, maintaining the first temperature, and cooling the glass part to a second temperature using a controlled cooling process. Chemically strengthening the glass part includes facilitating an ion exchange between ions included in the glass part and ions included in a chemical strengthening bath.

公开(公告)号：MX2012008888A

公开(公告)日：2013-02-15

申请号：MX2012008888

申请日：2010-09-24

Applicant: APPLE INC

Inventor： MYERS SCOTT ,  HELEY RICHARD ,  THEOBALD MATTHEW ,  STAGNARO ADAM ,  TAN TANG ,  DINH RICHARD ,  PAKULA DAVID

IPC: H04M1/02 ,  G06F1/16

Abstract: El presente esta dirigido a una carcasa para dispositivo electrónico. La carcasa incluye un miembro de periferia externa y una superficie externa del dispositivo, y en donde se conecte la plataforma. Los componentes del dispositivo electrónico pueden ser armados en una o en ambas de la plataforma interna. La carcasa puede incluir configuraciones frontal y posterior armadas en superficies opuestas del miembro de periferia externa para retener los componentes del de dispositivo electrónico. Una o ambas de las configuraciones de cubierta pueden incluir una ventana a trasvés dela cual se muestra circuitos que proporcionan contenidos al usuario sobre el dipositivo.

公开(公告)号：AU2010345077B2

公开(公告)日：2015-10-01

申请号：AU2010345077

申请日：2010-09-22

Applicant: APPLE INC

Inventor： PAKULA DAVID ,  DINH RICHARD HUNG MINH ,  MYERS SCOTT ,  TAN TANG YEW

IPC: G06F1/16

Abstract: Improved housings for electronic devices are disclosed. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. In other embodiments, apparatus, systems and methods for robustly attaching a cover portion of an electronic device to a bottom portion, e.g., a housing portion, of the electronic device are described. The electronic device can be portable and in some cases handheld.

公开(公告)号：AU2010345079B2

公开(公告)日：2014-12-04

申请号：AU2010345079

申请日：2010-09-24

Applicant: APPLE INC

Inventor： MYERS SCOTT ,  THEOBALD MATTHEW ,  HELEY RICHARD ,  STAGNARO ADAM ,  DINH RICHARD ,  PAKULA DAVID ,  TAN TANG

IPC: G06F1/16 ,  H04M1/02

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

公开(公告)号：MX2012008887A

公开(公告)日：2012-12-17

申请号：MX2012008887

申请日：2010-09-24

Applicant: APPLE INC

Inventor： MYERS SCOTT ,  HELEY RICHARD ,  THEOBALD MATTHEW ,  STAGNARO ADAM ,  TAN TANG ,  DINH RICHARD ,  PAKULA DAVID

IPC: G06F1/16

Abstract: Este invento esta dirigido a proporcionar un terminado cosmético en un componente al conectar varios elementos. Un proceso de manufactura único, de tal forma que el pulido mecanizado se pueda aplicar a los elementos conectados para quitar el material de alguno o de todos lo elementos y formar una superficie suave y continua en todas las interfaces entre los elementos individuales del componente. En algunos casos, la configuración se puede ajustar con base en las propiedades mecánicas o de manufactura de cada elemento material.

公开(公告)号：AU2010345078A1

公开(公告)日：2012-08-30

申请号：AU2010345078

申请日：2010-09-24

Applicant: APPLE INC

Inventor： MYERS SCOTT ,  HELEY RICHARD ,  THEOBALD MATTHEW ,  STAGNARO ADAM ,  TAN TANG ,  DINH RICHARD ,  PAKULA DAVID

IPC: G06F1/16

Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.