公开(公告)号：US20160256979A1

公开(公告)日：2016-09-08

申请号：US14714876

申请日：2015-05-18

Applicant: Apple Inc.

Inventor： Naoto Matsuyuki ,  Bin Yi ,  Dezheng Qu ,  Jairam Manjunathaiah ,  Scott M. Nathanson ,  Trevor J. Ness ,  David I. Nazzaro ,  Raul A. Molina

IPC: B24B37/04 ,  B29C70/88 ,  B29C65/50 ,  C03C25/00 ,  B29C70/74

CPC classification number: B24B37/042 ,  B24B37/02 ,  B24B37/025 ,  B29C70/745 ,  B29C70/88 ,  C03C25/005 ,  F16B11/006

Abstract: A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.

Abstract translation: 一种用于共整理表面的方法将由第一材料形成的第一结构粘结在具有由第二材料形成的第二结构中限定的孔中的第一表面，并且具有第二表面，使得在第一表面和第二表面之间存在偏移 第二个表面。 共同研磨第一表面和第二表面以减少偏移。 第一表面和第二表面被共抛光以进一步减少偏移。 然后第一表面和第二表面可以是齐平的。 可以将第一表面的边缘倒角以减轻在共研磨和/或共抛光期间的损伤。 填充材料可以位于第一和第二结构之间的间隙中，以减轻在共研磨和/或共抛光期间的损伤。

公开(公告)号：US10207387B2

公开(公告)日：2019-02-19

申请号：US14714876

申请日：2015-05-18

Applicant: Apple Inc.

Inventor： Naoto Matsuyuki ,  Bin Yi ,  Dezheng Qu ,  Jairam Manjunathaiah ,  Scott M. Nathanson ,  Trevor J. Ness ,  David I. Nazzaro ,  Raul A. Molina

IPC: B24B37/04 ,  B29C70/74 ,  C03C25/005 ,  B29C70/88 ,  B24B37/025 ,  B24B37/02

Abstract: A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.