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    PASS-THROUGH CONNECTORS FOR CONNECTOR SYSTEMS
    1.
    发明申请
    PASS-THROUGH CONNECTORS FOR CONNECTOR SYSTEMS 有权

    公开(公告)号：US20230087891A1

    公开(公告)日：2023-03-23

    申请号：US17482879

    申请日：2021-09-23

    Applicant: Apple Inc.

    Inventor： Michael A. Kinney ,  Mahmoud R. Amini

    IPC: H01R12/70

    Abstract: Methods and apparatus that can allow an electronic device housed in a protective accessory to communicate with another electronic device, and are readily manufactured. An example can provide a connector assembly that can include a number of top contacts electrically connected to a corresponding number of bottom contacts. The top contacts can be spaced at a first pitch while the bottom contacts can be spaced at a second pitch, the second pitch different than the first pitch.

    Connector assembly having a low-impedance ground connection
    3.
    发明授权
    Connector assembly having a low-impedance ground connection 有权

    公开(公告)号：US10950984B1

    公开(公告)日：2021-03-16

    申请号：US16586714

    申请日：2019-09-27

    Applicant: Apple Inc.

    Inventor： Michael A. Kinney ,  Mahmoud R. Amini ,  Rui Zhou ,  Brock A. Zekany

    IPC: H01R13/6591 ,  H01R33/94 ,  H01R13/518 ,  H01R33/945 ,  H01R33/74

    Abstract: An accessory for an electronic device includes a plug connector that is configured to connect to an electronic device when the electronic device is received by the accessory. The accessory also includes a receptacle connector at an exterior surface for coupling the accessory to a charging system when a mating connector is received within a receiving cavity of the receptacle connector. A bracket electrically and mechanically couples the plug connector to the receptacle connector. A ground spring is coupled to an exterior metallic shell of the receptacle connector and has a pair of spring arms that each have a distal end positioned within the receiving cavity such that when a mating plug connector is received within the receiving cavity a low-impedance ground path is formed between the mating connector and the plug connector.

    CONNECTOR ASSEMBLY HAVING A LOW-IMPEDANCE GROUND CONNECTION
    4.
    发明申请
    CONNECTOR ASSEMBLY HAVING A LOW-IMPEDANCE GROUND CONNECTION 有权

    公开(公告)号：US20210098944A1

    公开(公告)日：2021-04-01

    申请号：US16586714

    申请日：2019-09-27

    Applicant: Apple Inc.

    Inventor： Michael A. Kinney ,  Mahmoud R. Amini ,  Rui Zhou ,  Brock A. Zekany

    IPC: H01R13/6591 ,  H01R33/94 ,  H01R13/518

    Abstract: An accessory for an electronic device includes a plug connector that is configured to connect to an electronic device when the electronic device is received by the accessory. The accessory also includes a receptacle connector at an exterior surface for coupling the accessory to a charging system when a mating connector is received within a receiving cavity of the receptacle connector. A bracket electrically and mechanically couples the plug connector to the receptacle connector. A ground spring is coupled to an exterior metallic shell of the receptacle connector and has a pair of spring arms that each have a distal end positioned within the receiving cavity such that when a mating plug connector is received within the receiving cavity a low-impedance ground path is formed between the mating connector and the plug connector.

    MULTI-NODE ELECTRONIC DEVICE
    5.
    发明申请
    MULTI-NODE ELECTRONIC DEVICE 有权

    公开(公告)号：US20250004502A1

    公开(公告)日：2025-01-02

    申请号：US18746824

    申请日：2024-06-18

    Applicant: Apple Inc.

    Inventor： Li-Tyng Hung ,  Maegan K. Spencer ,  Albert Wang ,  Salome Bavetta ,  Lindsay M. Epstein ,  Wing Shan Wong ,  Wegene H. Tadele ,  Michael A. Kinney ,  Aaron N. Miletich

    IPC: G06F1/16

    Abstract: Embodiments are directed to wearable electronic devices including a band having a flexible layer and a routing layer coupled to the flexible layer. The routing layer including one or more electrical traces. A first enclosure is coupled to the band at a first opening and includes a first upper enclosure segment coupled to a first side of the band and a first lower enclosure segment coupled to a second side of the band. A processing unit is enclosed within the first enclosure and electrically coupled to the routing layer. A second enclosure is coupled to the band at a second opening and includes a second upper enclosure segment coupled to the first side of the band and a second lower enclosure segment coupled to the second side of the band. A battery is enclosed within the second enclosure and electrically coupled to the processing unit via the routing layer.

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