公开(公告)号：EP4201872A1

公开(公告)日：2023-06-28

申请号：EP21217618.4

申请日：2021-12-23

Applicant: Audio Pixels Ltd.

Inventor： LURIE, Dmitri ,  HOREV, Menachem ,  COHEN, Yuval ,  LEWIN, Daniel ,  MOR CHAIM, Yogev ,  HALACHMY, Rephael

IPC: B81C1/00

Abstract: The present disclosure provides a method for use in manufacturing a microsystem, the method comprising forming an array of pillars in a thickness of a substrate, an area surrounding the array of pillars defining a cavity in the substrate; transforming at least some of the pillars into a sacrificial material; and depositing a sacrificial material layer using a non-conformal deposition process to fill up the cavity while enclosing hollow channels between the pillars of the pillars array, thereby obtaining a cavity filled with an etching facilitator arrangement.