STABILIZATION OF POLYAMIDE WITH COPPER-BASED METAL ORGANIC FRAMEWORKS
    1.
    发明申请
    STABILIZATION OF POLYAMIDE WITH COPPER-BASED METAL ORGANIC FRAMEWORKS 审中-公开
    聚合物与铜基金属有机骨架的稳定性

    公开(公告)号:US20160060434A1

    公开(公告)日:2016-03-03

    申请号:US14783531

    申请日:2014-04-07

    Applicant: BASF SE

    Abstract: The invention relates to a method for manufacturing of a stabilized polyamide-containing composition, which contains at least 20% by weight of polyamide, which comprises the steps of incorporating of a metal organic framework, which is a copper-based metal organic framework comprising metal ions, which are copper(II)-ions, and a C6-C24 aromatic hydrocarbon, which is substituted with at least two carboxylate groups, wherein two of the at least two carboxylate groups are forming coordinative bonds to the metal ions, into a polyamide-containing composition, which contains at least 20% by weight of polyamide, to obtain a mixture for molding, which contains at least 20% by weight of polyamide; and heating of the obtained mixture for molding comprising the polyamide-containing composition and the metal organic framework to a temperature between 170° C. and 380° C.

    Abstract translation: 本发明涉及含有至少20重量%聚酰胺的含稳定的含有聚酰胺的组合物的制造方法,该方法包括以下步骤:引入金属有机骨架,其为包含金属的铜基金属有机骨架 离子(它们是铜(II))和被至少两个羧酸酯基团取代的C 6 -C 24芳族烃,其中两个至少两个羧酸酯基团与金属离子形成配位键,形成聚酰胺 含有至少20重量%的聚酰胺的组合物,以获得含有至少20重量%的聚酰胺的模塑混合物; 并将得到的含有聚酰胺的组合物和金属有机骨架的模塑混合物加热至170℃至380℃的温度。

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